Mechanical Power Engineering Department
Faculty of Engineering
Cairo University
Egypt
MPE 635: Electronics Cooling
Part A: Introduction to Electronics Cooling
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1. Introduction |
2. Packaging Trends and Thermal Management |
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3. Basics of Heat Transfer |
Part B: Heat Transfer Principles in Electronics Cooling
Part C: Electronics Cooling Methods in Industry
Part D: Packaging of Electronic Equipments
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21. Components of Electronic Systems |
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22. Packaging of Electronic Equipments (1) |
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23. Packaging of Electronic Equipments (2) |
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24. Conduction Cooling for Chassis and Circuit Boards |
Part E: Analysis of Thermal Failure of Electronic Components
PPT | Topic | |
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25. Analysis of Thermal Stresses and Strain |
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26. Effect of PCB Bending Stiffness on Wire Stresses |
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27. Vibration Fatigue in Lead Wires and Solder Joints |
Part F: Practical Applications
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28. Fan-Cooled Enclosure of a PC System |
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29. Flow over a Heat Sink |
Part G: Appendices
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G.1 Course Specifications |
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G.2 Problem Bank |
G.3 Solved Problems |
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G.4 Sample Exams |
G.5 Contents of Courses and Books |
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G.6 Internet Links |
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G.7 References |