Mechanical Power Engineering Department
Faculty of Engineering
Cairo University
Egypt
MPE 635: Electronics Cooling
Part A: Introduction to Electronics Cooling
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1. Introduction |
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2. Packaging Trends and Thermal Management |
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3. Basics of Heat Transfer |
Part B: Heat Transfer Principles in Electronics Cooling
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4. Conduction Heat Transfer |
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5. Multi-Dimensional Conduction |
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6. Transient Conduction |
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7. Natural Convection in Electronic Devices |
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8. Forced Convection Heat Transfer |
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9. Forced Convection Correlations |
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10. Radiation Heat Transfer |
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11. Advanced Radiation |
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12. Case Study: Using EES in Electronics Cooling |
Part C: Electronics Cooling Methods in Industry
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13. Heat Sinks |
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14. Heat Pipes |
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15. Heat Pipes in Electronics Cooling (1) |
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16. Heat Pipes in Electronics Cooling (2) |
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17. Thermoelectric Cooling |
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18. Immersion Cooling |
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19. Cooling Techniques for High Density Electronics (1) |
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20. Cooling Techniques for High Density Electronics (2) |
Part D: Packaging of Electronic Equipments
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21. Components of Electronic Systems |
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22. Packaging of Electronic Equipments (1) |
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23. Packaging of Electronic Equipments (2) |
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24. Conduction Cooling for Chassis and Circuit Boards |
Part E: Analysis of Thermal Failure of Electronic Components
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25. Analysis of Thermal Stresses and Strain |
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26. Effect of PCB Bending Stiffness on Wire Stresses |
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27. Vibration Fatigue in Lead Wires and Solder Joints |
Part F: Practical Applications
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28. Fan-Cooled Enclosure of a PC System |
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29. Flow over a Heat Sink |
Part G: Appendices
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G.1 Course Specifications |
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G.2 Problem Bank |
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G.3 Solved Problems |
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G.4 Sample Exams |
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G.5 Contents of Courses and Books |
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G.6 Internet Links |
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G.7 References |